The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of ...

Fueled by booming demand for advanced packaging like CoWoS, a new report from China’s Wallstreetcn is turning heads with claims of a breakthrough “CoWoP” (Chip on Wafer on PCB) tech—mounting chips ...

Austin, July 08, 2025 (GLOBE NEWSWIRE) -- Substrate-Like PCB Market Size & Growth Insights: According to the SNS Insider,“The Substrate-Like PCB Market was valued at USD 1.93 billion in 2023 and is ...

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...

Silicon carbide (SiC) is best known as the wide-bandgap material driving high-efficiency power electronics that support the green transition. Yet its potential reaches beyond power electronics. SiC’s ...

Zhen Ding Technology made its debut at SEMICON Taiwan 2024, where the company highlighted the expanding role of IC substrates in advanced semiconductor manufacturing. At the 3D IC/CoWoS for AI forum ...

Brian Narveson, Independent Consultant and PSMA Board Member, and Greg Evans, CEO, WelComm Inc., and PSMA Marketing Committee, contributed to this article. It’s always been inevitable, that in system ...

TL;DR: NVIDIA is exploring CoWoP PCB packaging for its next-gen Rubin R150 AI GPUs, offering improved signal and power integrity, enhanced thermals, and reduced costs by eliminating the package lid.

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...