Bolstering high-end substrate production capabilities to meet semiconductor needs for AI and data centers December 17, 2025-- TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary ...

Samsung Electro-Mechanics and LG Innotek are accelerating their AI semiconductor substrate businesses. Samsung Electro-Mechanics recently started operating its Vietnam flip chip-ball grid array ...

CARROLLTON, Tex. — A spin-off of Amkor Technology Inc. in Texas is quietly developing and producing a new class of substrates that could accelerate the development of true system-in-packaging (SIP) ...

With Samsung Electro-Mechanics effectively having sold out next year's production volume of flip-chip ball grid array (FC-BGA), it is said to plan to ramp up the utilization rate of its Vietnam ...

LG Innotek, the electronic components corporations of LG Group, is seeing profitability improve as shipments of high-value camera modules for Apple's "iPhone 17 series" increase, and expectations for ...

Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are being disrupted by ...

A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in ...

Apple is continuing its work on the upcoming "M2" chip with help from Samsung Electro-Mechanics, ET News reports. Samsung Electro-Mechanics supplies the flip chip ball grid array (FC-BGA), a printed ...

Samsung Electro-Mechanics is collaborating with Apple on creating the M2 chip, beating out LG Innotek. Samsung is developing the flip chip ball grid array (FC-BGA) for the new generation of Apple ...