RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.

Historically, embedded IC package technology is not new at all: several players such as Freescale with its RCP, Infineon with its eWLB and Ibiden for die embedding into PCB laminated substrates have ...

WILSONVILLE, Ore.--(BUSINESS WIRE)--Mentor Graphics Corporation (NASDAQ: MENT), the market and technology leader in printed circuit board (PCB) design solutions, today announced the technology ...

The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of ...

The complexity and density of electronics design has increased, partly due to the rise of the mobile industry, introducing new challenges for printed-circuit board (PCB) designers. Embedding ...

BENGALURU, India, Oct. 21, 2025 /PRNewswire/ -- Embedded Substrate (ETS) Market is Segmented by Type (Embedded Passive Substrate(EPS), Embedded Trace Substrate(ETS), Embedded Dies Substrate(EDS)), by ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

Pune, Maharashtra, India, October 20 2020 (Wiredrelease) MarketResearch.Biz –:An extensive and elaborate primary research on Global Substrate-like PCB Market report sheds light on numerous facets such ...

PCB design and manufacturing company AT&S (Leoben, Austria) has brought together a range of technology options for miniaturization on all interconnection layers, in a “toolbox” that include embedded ...

Leuven, Belgium: A new 3D integration process will help foster a new level of flexibility in wearable electronics such as health and comfort monitoring. An ultra-thin chip package (UTCP) technology ...

We’ve reduced printed circuit board design to practice so much that we hardly give a thought to the details anymore. It’s so easy to bang out a design, send it to a fab house, and have ten boards in ...

What is the Market Size of Embedded Substrates (ETS)? The Global Embedded Substrate (ETS) Market was valued at USD 1242 Million in the year 2024 and is projected to reach a revised size of USD 2182 ...