A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
A new technical paper titled “A Survey on Acoustic Side-Channel Attacks: An Artificial Intelligence Perspective” was ...
A new technical paper titled “Gradient Electronic Landscapes in van der Waals Heterostructures” was published by researchers ...
Researchers from the Institute of Science Tokyo and Canon ANELVA Corporation built an ultrathin ferroelectric memory ...
Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...
Generative Golden Reference Hardware Fuzzing” was published by researchers at TU Darmstadt. Abstract “Modern hardware systems ...
A new technical paper titled “Deep-learning atomistic semi-empirical pseudopotential model for nanomaterials” was published ...
A new technical paper titled “Channel-last gate-all-around nanosheet oxide semiconductor transistors” was published by ...
A new technical paper titled “Hardware Acceleration for Neural Networks: A Comprehensive Survey” was published by researchers ...
What chip industry engineers were watching this year.
A new technical paper titled “Making Strong Error-Correcting Codes Work Effectively for HBM in AI Inference” was published by researchers at Rensselaer Polytechnic Institute, ScaleFlux and IBM T.J.
In the past, analysts, consultants, and many other experts attempted to estimate the cost of a new chip implemented in the latest process technology. They concluded that by the 3nm node, only a few ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback