Key market opportunities exist in the rapid growth and deployment of advanced SiC and GaN power devices within new energy vehicles, driven by increasing sales of 800V+ architecture vehicles. The ...

The new system, named POWER-750H and developed by the China Institute of Atomic Energy under the China National Nuclear Corp, ...

V SiC power modules includes a 608-A half-bridge module with 2.4-mΩ on-resistance and best-in-class thermal resistance.

As 2025 draws to a close, India’s manufacturing narrative looks very different from even five years ago. Apple’s expanding iPhone assembly lines, the steady localisation of electronics components, the ...

As global energy demand surges—driven by AI-hungry data centers, advanced manufacturing, and electrified ...

Next up for Intel is the Intel 14A process, which is scheduled for 2027. If everything goes according to plan, Intel will ...

Magnachip Semiconductor Corporation (NYSE: MX, "Magnachip") today announced the launch of its new series of Insulated Gate ...

Engineers from MIT say that stacking circuit components on top of each other could be the answer to creating more ...

, the company said in a statement seen by AFP on Dec 31. TSMC is the world’s largest contract maker of chips, used in everything from smartphones to missiles, and counts Nvidia and Apple among its ...

The RMCA automotive-grade thick film chip resistor series from Stackpole Electronics is qualified to the AEC-Q200 standard ...

The new analogue in-memory chip performs computation inside memory, lowering power consumption and latency for AI and data-center workloads.

Vishay Intertechnology 100 V Gen 2 TMBS® Rectifier Modules Deliver Forward Voltage Drop Down to 0.83 V in SOT-227 Package ...