Semiconductor Engineering

HBM4 Sticks With Microbumps, Postponing Hybrid Bonding

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...

EU troops might be needed to stop a US showdown in Greenland

If cooperation or Greenlandic independence fails, a preventive EU troop deployment could avert a US confrontation on the ...
IEEE

TSV process using bottom-up Cu electroplating and its reliability test

Abstract: TSV (through silicon via) is a core technology in 3D IC package. The micro vias can be made by etching or laser drilling. Standard processes for TSV filling begin with seed layer deposition, ...
IEEE

A Through Silicon Via (TSV) Architecture of the Bumpless Build Cube (BBCube) for Stacked Memory Devices

Abstract: This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs, $\mu $ ...