Researchers at the Department of Energy's Oak Ridge National Laboratory have developed a novel extrusion system that combines multiple 3D-printing extruders into a single, high-output stream via ...
Abstract: This paper describes the three-dimensional structure of a single-sided cooling power module that uses a lead frame as a heat conduction path to cool power semiconductor dies on both sides.
The Bosgame BeyondMax M6 is a powerful and flexible platform ideal for power users but affordable enough for most businesses.
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