PSMC plans to integrate advanced packaging technologies and materials—3D Wafer-on-Wafer (WoW) and Interposers—to pivot into a ...

The fabrication runs were enabled through the ChipIN Centre at C-DAC Bengaluru, which aggregates student-designed chips from ...

Intel (INTC) said it will spend more on tools in 2026 than it did in 2025, a potentially positive sign for chip equipment ...

By Wen-Yee Lee TAIPEI, Jan 19 (Reuters) - Shares of Taiwan's Powerchip Semiconductor Manufacturing Corp rose nearly 10% on ...

Micron is in a prime position to benefit from the increasing demand for high-bandwidth memory.

IC sense opens a new Electronic Wafer Sort (EWS) cleanroom to expand its in‑house ASIC production capabilities.

Intel CFO David Zinsner indicated that Intel is “prioritizing [its] internal wafer supply to data center” and having more of ...

Union Electronics and Information Technology Minister Ashwini Vaishnaw on Friday said India is on track to begin commercial semiconductor chip production in 2026, meeting the timeline set under the ...

Applied Materials, Inc. features recurring services revenue and targets a $381 price with FY27 growth acceleration. Find out ...

Ligebtec and X-Fab are to jointly bring X-Fab’s XPH90 Silicon Photonics (SOI) technology to market through its integration in Ligentec’s broader photonics platform portfolio, creating a unified ...

Will betting big on 18A pay off?