A new technical paper titled “The Quest for Reliable AI Accelerators: Cross-Layer Evaluation and Design Optimization” was ...

A new technical paper titled “Scaling of Two-Dimensional Semiconductor Nanoribbons for High-Performance Electronics” was ...

AI squeezes consumer memory market; 3D-IC basics, challenges; atomistic simulation; GPUs and auto security; AI-assisted ...

AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge ...

ALD for Ru wiring; vertical nanolasers; hydrogel semiconductors.

Semiconductor Engineering tracked 12 rounds of $100 million or more in Q4 and 11 in Q3, a significant increase from earlier ...

Beyond cold plates lies what’s sometimes called direct impingement, or direct liquid cooling (DLC), meaning that coolant ...

John Kibarian, CEO of PDF Solutions, talks with Semiconductor Engineering’s Ed Sperling about the growing role of AI in chip ...

A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation ...

Introducing multiple Arm64 variants of the JIT_WriteBarrier function. Each variant is tuned for a GC mode. Because many parts ...

PPA constraints need to be paired with real workloads, but they also need to be flexible to account for future changes.

Power management is one of the keys for developing successful semiconductors products. There are virtually no applications ...