Abstract: This study presents the latest advancements in high-density wafer-level connectivity. We achieve face-to-face hybrid bonding at 250nm pitch. Access from the wafer backside is demonstrated ...

Abstract: Wafer-level power devices, including thyristors, and their derivatives, such as integrated gate-commutated thyristors (IGCTs), demand a higher performance by the electrical transmission ...

INDIANAPOLIS– Getting out of jail on bond in Marion County in 2026 will be significantly more expensive than it was before, following major changes to the county’s bail structure. The new bond rules ...

NEW YORK, Dec 29 (Reuters) - Since President Donald Trump's 'Liberation Day' tariffs pushed the U.S. bond market into revolt in April, his administration has carefully tailored its policies and ...

Rahul Malhotra is a Weekend News Writer for Collider. From Francois Ozon to David Fincher, he'll watch anything once. He has been writing for Collider for over two years, and has covered everything ...